本期講解的是PCB設計中常見DRC及修正方法。
DRC的種類：
1. physical類型的：線寬不對（L/W）
spacing類型的：線與孔的間距（V/L）
design類型：器件干涉（P/P）
同名網絡類型：線與線（L/L）
下面介紹我們在軟件中所見到的錯誤類型中各代碼的含義：
字符代碼 | 相關對象 | 說明 |
L | Line | 走線 |
P | Pin | 元件腳 |
V | Via | 貫穿孔 |
K | Keep in/out | 允許區域/禁止區域 |
C | Component | 元件 |
E | Electrical Constraint | 電氣約束 |
雙字符錯誤代碼 | ||
ED | Propagation-Delay | 走線的長度錯誤 |
Relative-Propagation-Delay | 走線的等長錯誤 | |
JN | T Junction Not Allowed | 走線呈T形的錯誤 |
KL | Line to Route Keepin Spacing | 走線在Route Keepin之外 |
Line to Route Keepout Spacing | 走線在Route Keepout之內 | |
KS | Shape to Route Keepin Spacing | Shape在Route Keepin之外 |
Shape to Route Keepout Spacing | Shape在Route Keepout之內 | |
KV | BBVia to Route Keepin Spacing | BBVia在Route Keepin之外 |
BBVia to Route Keepout Spacing | BBVia在Route Keepout之內 | |
BBVia to Via Keepout Spacing | BBVia在Via Keepout之內 | |
Test Via to Route Keepin Spacing | Test Via在Route Keepin之外 | |
Test Via to Route Keepout Spacing | Test Via在Route Keepout之內 | |
Test Via to Via Keepout Spacing | Test Via在Via Keepout之內 | |
Through Via to Route Keepin Spacing | Through Via在Route Keepin之外 | |
Through Via to Route Keepout Spacing | Through Via在Route Keepout之內 | |
Through Via to Via Keepout Spacing | Through Via在Via Keepout之內 | |
LL | Line to Line Spacing | 走線之間太近 |
LS | Line to Shape Spacing | 走線與Shape 太近 |
LW | Min Line Width | 走線的寬度太細 |
Min Neck Width | 走線變細的寬度太細 | |
PL | Line to SMD Pin Spacing | 走線與SMD元件腳太近 |
Line to Test Pin Spacing | 走線與Test元件腳太近 | |
Line to Through Pin Spacing | 走線與Through元件腳太近 | |
PP | SMD Pin to SMD Pin Spacing | SMD元件腳與SMD元件腳太近 |
SMD Pin to Test Pin Spacing | SMD元件腳與Test元件腳太近 | |
Test Pin to Test Pin Spacing | Test元件腳與Test元件腳太近 | |
Test Pin to Through Pin Spacing | Test元件腳與Through元件腳太近 | |
Through Pin to SMD Pin Spacing | Through元件腳與SMD元件腳太近 | |
Through Pin to Through Pin Spacing | Through元件腳與Through元件腳太近 | |
PS | Shape to SMD Pin Spacing | Shape與SMD元件腳太近 |
Shape to Test Pin Spacing | Shape與Test元件腳太近 | |
Through Pin to Shape Spacing | Through元件腳與Shape太近 | |
PV | BBVia to SMD Pin Spacing | BBVia與SMD元件腳太近 |
BBVia to Test Pin Spacing | BBVia與Test元件腳太近 | |
BBVia to Through Pin Spacing | BBVia 與Through元件腳太近 | |
SMD Pin to Test Via Spacing | SMD Pin與Test Via太近 | |
SMD Pin to Through Via Spacing | SMD Pin與Through Via太近 | |
Test Pin to Test Via Spacing | Test Pin與Test Via太近 | |
Test Pin to Through Via Spacing | Test Pin與Through Via太近 | |
Test Via to Through Pin Spacing | Test Via與Through Pin太近 | |
Through Pin to Through Via Spacing | Through Pin與Through Via太近 | |
VG | Max BB Via Stagger Distance | 同一段線的BB Via之間的距離太長 |
Min BB Via Gap | BB Via之間太近 | |
Min BB Via Stagger Distance | 同一段線的BB Via之間的距離太近 | |
Pad/Pad Direct Connect | Pad 在另一個Pad 之上 | |
VL | BB Via to Line Spacing | BB Via與走線太近 |
Line to Through Via Spacing | 走線與Through Via太近 | |
Line to Test Via Spacing | 走線與Test Via太近 | |
VS | BB Via to Shape Spacing | BB Via與Shape太近 |
Shape to Test Via Spacing | Shape 與Test Via太近 | |
Shape to Through Via Spacing | Shape與Through Via太近 | |
VV | BB Via to BB ViaSpacing | BB Via之間太近 |
BB Via to Test Via Spacing | BB Via與Test Via太近 | |
BB Via to Through Via Spacing | BB Via與Through Via太近 | |
Test Via to Test Via Spacing | Test Via之間太近 | |
Test Via to Through Via Spacing | Test Via與Through Via太近 | |
Through Via to Through Via Spacing | Through Via之間太近 |
解決DRC的方法：
1. 找出DRC的原因：如L：L的DRC，則表明是線到線的間距不滿足要求；
2. 針對上面的原因，我們拉大線到線的間距使它滿足要求即可。
如何設置DRC標識符號的大小：
在allegro的如下菜單中
調整DRC marker size的大小，點ok即可
以上便是PCB設計中常見DRC及修正方法，下期預告：通常的Checklist檢查。請同學們持續關注【快點兒PCB學院】，PCB設計培訓生長期招 募，歡迎諮詢。
相關推薦
